Headphone Repair Module
Mechanical Design | Product Engineering | Rapid Prototyping
I designed and prototyped a custom 3D-printed mechanical repair module to address a structural failure in a personal headphone band. The original issue was a sudden lateral break near the hinge, rendering the headphones unusable. My solution used a tension-based clamping system, reinforced with a woven elastic mechanism, to redistribute forces and restore mechanical integrity without impairing flexibility or comfort.
Design Features
Modular Clamp: Symmetrical design allows the same clamp to be used on either side of the band
Tension-Based Weaving: Elastic is threaded over and around the structure in a locked pattern to constrain motion in all axes
Adjustable Geometry: Accommodates variations in headphone curvature and failure location
Material Strategy: PLA for rigid printed components, elastic cord for flexible reinforcement—balanced for structure, comfort, and visual coherence
Development Process
Modeled in Onshape with parametric constraints to support rapid customization
Iterated through five design versions, refining ergonomics and mechanical response through daily wear tests
Prototypes printed in PLA; failure points were analyzed under cyclical flexing over ~10 hours of cumulative use
Final assembly restored full functionality for 6+ months of active daily use; repair can be easily reprinted and restrung if failure recurs